• pro-bond 20F: Ultra Low Dk/Df Resin Coated Film Bondply

    UL Approval: E214381 09/08/2024

    Resin Coated Film (RCF) Bondply is an unreinforced adhesive system coated onto PET film for use in high performance and high reliability multilayer PCB stack-ups.

    VT-8728 is an ultra-low Dk (2.85) & low Df (0.0020), high Tg, ceramic-filled hydrocarbon, halogen-free thermoset resin system, specifically designed for use in multilayer PCBs with Ventec tec-speed 20.0 laminates & prepregs and tec-speed 30.0 laminates. It is also fully compatible with other resin systems in hybrid stack-ups.

    General Information

    • Halogen free, Dk 2.85 & Df 0.0020
    • Stable Dk over temperature
    • Ultra-thin dielectric layer
    • Suitable for sequential laminations
    • Unreinforced adhesive for better electrical isotropic consistency
    • Excellent flow characteristics and filling ability, designed for inner layer 1oz

    Application

    • Filters & Couplers
    • Military, Aerospace Radar
    • Automotive Radar
    • Beam Steering Antenna
    • IC Test Sockets
    • RF multilayer especially for mmWave frequency, high speed digital and ATE.

    Storage Condition

    RCF
    Storage Condition Temperature Below 23˚C (73˚F) Below 5˚C (41˚F)
    Relative Humidity Below 55% RH /

    Properties

    Properties Test Method Units Typical Value
    8728-FN/FL 8728-FR
    Dk (RC 50%) @ 1GHz IPC-TM-650 2.5.5.13 - 3.15 3.05
    @ 10GHz 2.96 2.85
    Df @ 1GHz IPC-TM-650 2.5.5.13 - 0.0015
    @ 10GHz 0.0020
    Tg DMA IPC-TM-650 2.4.24.4 °C 210
    Td TGA ASTM D3850 °C 400
    CTE α1 (<Tg) IPC-TM-650 2.4.24 ppm/°C 65 (-50 - 125˚C)
    α2 (>Tg) 85
    Thermal Stress @ 288˚C (10s/Cycle) IPC-TM-650 2.4.13.1 Second >300
    Thermal Conductivity ASTM D5470 W/mK 0.6
    Peel Strength (1oz) IPC-TM-650 2.4.8 N/mm (lb/in) 0.14 (6.5)
    Tensile Modulus 40˚C IPC-TM-650 2.4.24.4 GPa 5.5
    Moisture Absorption IPC-TM-650 2.6.2.1 % 0.08
    Flammability (in Lab) UL-94 Rating V-0

    All test data provided are typical and not intended to be specification values.

    Availability

    Press Ply Thickness 50μ/110μ (0.0020”/0.0043”)
    Panel Size 610mmx457mm (24”x18”)
    Carrier Film Type T

    Other options available upon request

    Part Numbers

    Description Part Number Thickness (μm) Flow Range
    pro-bond 20F RCF No Flow PPT 50μm 8728-FT N-050 50 10~30
    pro-bond 20F RCF Low Flow PPT 50μm 8728-FT L-050 50 30~80
    pro-bond 20F RCF No Flow PPT 110μm 8728-FT N-110 110 10~60
    pro-bond 20F RCF Low Flow PPT 110μm 8728-FT L-110 110 60~120
    pro-bond 20F RCF Regular Flow PPT 110μm 8728-FT R-110 110 120~180

    Download TDS Datasheet