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VT-441C(G1) Laminate/Prepreg
Version: 10/03/2025 /127/128General Information
- Phenolic Cured System
- Halogen free & Mid-Tg
- FR15.1 & MOT 150˚C
- CTI Grade-1
- UV Blocking
- CAF Resistance
- Low Z-CTE
- Excellent Thermal Reliability
Application
- Automotive
- Instrumentation
- Communication Equipment
- Electronic Game Machines
- White Goods, etc.
Availability
- Core Thickness: 0.004” (0.10mm) to 0.200” (5mm), available in sheet or panel form
- Copper Foil: 1/2oz to 12oz
- Prepregs are available in roll or panel form
- E-Glass styles: 7628, 2116, 1080
Properties Prepreg Laminate Storage Condition Temperature Below 23°C (73°F) Below 5°C (41°F) Room Relative humidity Below 55% RH / / Shelf Life 3 months 6 months 24 months (airproof) The prepreg exceeding shelf life should be retested.
Properties Sheet IPC-4101E /127 /128
Properties Test Method Units Specification Typical Value Thermal Properties Tg IPC-TM-650 2.4.25 °C 150 minimum 155 Td ASTM D3850 °C 325 minimum 385 T260 IPC-TM-650 2.4.24.1 Minute 30 minimum >60 T288 IPC-TM-650 2.4.24.1 Minute 5 minimum >15 Thermal Stress @ 288°C IPC-TM-650 2.4.13.1 Second Pass 10s >200 Z-axis CTE Before Tg IPC-TM-650 2.4.24 ppm/°C 60 maximum 35 After Tg IPC-TM-650 2.4.24 ppm/°C 300 maximum 190 Total Expansion (50~260°C) IPC-TM-650 2.4.24 % 3.5 maximum 2.2 MOT UL 746E °C - 150 Electrical Properties Dk @ 1GHz IPC-TM-650 2.5.5.9 - 5.4 maximum 4.6 Df @ 1GHz IPC-TM-650 2.5.5.9 - 0.035 maximum 0.011 Volume Resistivity After Moisture Resistance IPC-TM-650 2.5.17.1 MΩ-cm 1.0E+4 minimum 5.0E+8 E-24/125 IPC-TM-650 2.5.17.1 MΩ-cm 1.0E+3 minimum 5.0E+6 Surface Resistivity After Moisture Resistance IPC-TM-650 2.5.17.1 MΩ 1.0E+4 minimum 5.0E+7 E-24/125 IPC-TM-650 2.5.17.1 MΩ 1.0E+3 minimum 5.0E+6 Electrical Strength IPC-TM-650 2.5.6.2 Volt/mil (KV/mm) 762 (30) minimum 1200~1400 (54) Dielectric Breakdown IPC-TM-650 2.5.6 KV 40 minimum 60 Comparative Tracking Index (CTI) ASTM D3638 Rating (Volt) - Grade 1 (600>CTI≥400) Arc Resistance ASTM D495 Second - 187 Mechanical Properties Peel Strength (1oz) As received IPC-TM-650 2.4.8 lb/in (N/mm) - 8.0~8.5 (1.4~1.49) After thermal stress IPC-TM-650 2.4.8 lb/in (N/mm) 6 (1.05) minimum 8.0~8.5 (1.4~1.49) Flexural Strength Warp IPC-TM-650 2.4.4 KPsi (MPa) 60 (415) minimum 72 (500) Fill IPC-TM-650 2.4.4 KPsi (MPa) 50 (345) minimum 58 (400) Physical Properties Moisture Absorption IPC-TM-650 2.6.2.1 % 0.80 maximum 0.18 Flammability UL-94 Rating V-0 minimum V-0 All test data provided are typical values and not intended to be specification values. Disclaimer: The information and data contained in this technical literature is based on data and knowledge correct at the time of publishing/printing and is believed to be accurate and is offered in good faith for the benefit of the user. The user should make his own tests to verify the suitability of this product for any application before its use. All data are typical values only and subject to change without notice.
Published on: 10/03/2025
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VT-441C(G1) Laminate/Prepreg
UL Approval: E214381 Version: 10/03/2025 /127/128Storage Condition & Shelf Life
Prepreg Laminate Storage Condition Temperature < 23℃ (73℉) < 5℃ (41℉) Room Relative Humidity < 55% / / Shelf Life 3 Months 6 Months 24 Months - The prepreg exceeding shelf time should be retested.
- Take care in handling thin core laminates as they are easily damaged.
- If the prepreg is not consumed within 48hrs after opening the vacuum package, it is recommended that the bags be resealed.
- Material is available in both long and short grain. The grain direction is indicated on the label with an arrow.
Precautions In Handling
- Please be careful when single ply of 1080 prepreg is designed to the dielectric layer.
- VT-441C(G1) has weaker thermal resistance than regular VT-441. Please be very careful when 8L and higher layer count is designed or dielectric with single ply of 1080.
- VT-441C(G1) Dk is a little higher than VT-441. Please take it into consideration whenever impendence control is required.
- CTI grade-1 only can be guaranteed when the full stack-up is from VT-441C(G1) material.
- Please be noticed that the surface roughness and clearness affect CTI rating.
Prepreg Availability
PP Type Resin Content Press Thickness (mil) DK DF @ 1GHz @ 2GHz @ 5GHz @ 10GHz @ 1GHz @ 2GHz @ 5GHz @ 10GHz 7628 50% 8.0 4.9 4.9 4.8 4.8 0.011 0.011 0.012 0.012 7628 46% 7.5 5.0 5.0 4.9 4.9 0.010 0.010 0.011 0.011 2116 58% 5.0 4.7 4.6 4.6 4.5 0.012 0.012 0.013 0.013 1080 68% 3.1 4.3 4.3 4.2 4.2 0.013 0.013 0.014 0.014 Remark: More types could be available upon request. When 2116PP or/and 1080PP is used as the outmost layer, 2-ply minimum is required to ensure CTI GRADE-1.
Laminate Availablity
Core Thickness Stack-up Resin Content DK DF mm inches @ 1GHz @ 2GHz @ 5GHz @ 10GHz @ 1GHz @ 2GHz @ 5GHz @ 10GHz 0.20 0.008 1-7628 46% 4.6 4.6 4.5 4.5 0.011 0.011 0.012 0.012 0.30 0.012 2-1506 46% 4.6 4.6 4.5 4.5 0.011 0.011 0.012 0.012 0.38 0.015 2-7628 46% 4.6 4.6 4.5 4.5 0.011 0.011 0.012 0.012 0.41 0.016 2-7628 46% 4.6 4.6 4.5 4.5 0.011 0.011 0.012 0.012 0.76 0.030 4-7628 46% 4.6 4.6 4.5 4.5 0.011 0.011 0.012 0.012 0.91 0.036 5-7628 46% 4.6 4.6 4.5 4.5 0.011 0.011 0.012 0.012 1.07 0.042 6-7628 46% 4.6 4.6 4.5 4.5 0.011 0.011 0.012 0.012 1.37 0.054 7-7628 46% 4.6 4.6 4.5 4.5 0.011 0.011 0.012 0.012 1.45 0.057 8-7628 46% 4.6 4.6 4.5 4.5 0.011 0.011 0.012 0.012 1.47 0.058 8-7628 46% 4.6 4.6 4.5 4.5 0.011 0.011 0.012 0.012 1.52 0.060 8-7628 46% 4.6 4.6 4.5 4.5 0.011 0.011 0.012 0.012 Press Condition
1. Heating rate (Rate of Rise) of material [Material Temperature]: Programmable Press: 1.5~3.0ºC/min 2. Curing Temperature & Time: >60min at more than 180ºC (356ºF) Material temperature 3. Full Pressure: ≥300psi and temperature to apply full pressure before ≤80ºC 4. Vacuuming should be continued until over 140ºC [Material Temperature] 5. Cold Press condition: Keep Plate @ Room Temperature by water; Pressure:100psi; Keep Time: 60minutesTypical Drilling Conditions
VT-441C(G1) is high fillers system, please adjust drill parameters according to other Middle Tg FR-4. New drill bit, single stack and less hit count is recommended for getting better hole wall quality. Besides, run FA to get optimal drill parameters are necessary.Diameter Stack Height Spindle (KRPM) Infeed (mm/s) Retract (mm/s) Hit Count 0.25mm 1 PNL/Stack 130 38 300 800-1000 0.30mm 1 PNL/Stack 130 38 300 800-1000 0.60mm 1 PNL/Stack 80 43 300 800-1000 1. Excessive wear of carbide drill bits. Diamond coated drill bits preferred; 2. For dense holes area or hole size, LE Aluminum sheet and white phenolic entry board are preferred;
Desmearing Process
The de-smearing rate of VT-441C(G1) is less than regular VT-441. 1 time vertical de-smearing is preferred. Please examine hole wall to check de-smearing effect. Typical de-smearing rate for reference only:1x De-smearing Supplier Chemical 0.27mg/cm2 Atotech Alkaline Permanganate Punching/Routing
Not suitable for punching process. Routing process is recommended. Reduce routing speed to prevent edge cracks from outburst mechanical force.Packaging and baking recommendation
1. It is recommended to bake the board before packaging at 125ºC/4~8h to avoid moisture causing a decrease in heat resistance. 2. If the PCBs needs to be stored for a long time before use, it is recommended to use aluminum foil vacuum packaging. 3. If exceed 3 months after packaging , It is best to bake the PCBs at 125ºC/4~6h before assembly before use.