12 March 2025
Ventec International Group announce launch of VT-47LT IPC4101 / 126 Prepreg.
Are Microvia Failures Plaguing Your HDI Any Layer Designs?
High-density interconnect (HDI) designs are pushing the envelope - higher layer count HDI relies on complex microvia designs: skip vias, staggered microvias, and stacked microvias in sequential laminations. But there’s a critical flaw: microvias fail far more often than plated through-holes in advanced designs, putting reliability on the line.
The root cause? Thermal mismatch. Differences in coefficient of thermal expansion (CTE) between the microvia fill material and surrounding dielectric create stress during thermal excursions, weakening the microvia barrel and cap. It gets worse, copper and epoxy expand and contract at different rates under thermal cycling, with epoxy’s higher CTE driving tensile stress on the copper cap plating. Repeated thermal cycling intensifies this fatigue initiating micro-cracks that spread into the microvia barrel or epoxy core, threatening the integrity of the entire interconnect.
Introducing VT-47LT: Next-Generation Low CTE prepreg for HDI Innovation
Ventec’s VT-47LT, a cutting-edge IPC 4101/126 prepreg that steps up to meet the demands of modern HDI technology, avoiding the need for time consuming and expensive requalification of alternative IPC4101 grades. With best-in-class Z-axis CTE, it delivers unrivalled reliability right where you need it. Its advanced low-CTE epoxy slashes thermal expansion mismatches, easing stress on microvia structures and tackling the persistent challenge of failures head-on.
Engineered with optimized properties, best-in-class Z-axis CTE and superior thermal resilience, VT-47LT cuts stress on microvias, reducing crack risks and boosting durability. It’s a game-changer delivering robust, long lasting HDI PCBs.
Elevate your HDI projects with VT-47LT — where reliability meets innovation!
www.ventec-group.com/products/lead-free-assembly/vt-47lt/datasheet
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