• thermal-bond 5.0F: Thermally Conductive Resin Coated Film Bondply

    UL Approval: E214381 30/04/2024

    Resin Coated Film (RCF) Bondply is an unreinforced adhesive system coated onto PET film for use in high performance and high reliability multilayer PCB stack-ups.

    VT-4B7H is a high Tg, ceramic-filled, thermally conductive (7.0 W/mK), halogen-free thermoset resin system, specifically designed for use in multilayer PCBs requiring enhanced levels of heat management and thermal conductivity. Thermal-bond RCF can be combined with other Ventec laminate & prepreg systems including tec-thermal IMS, VT-5A2 and VT-4A2H thermally conductive laminates & prepregs in hybrid stackups.

    General Information

    • Thermal Conductivity – 7.0 W/mK
    • Tg 210ºC
    • Ceramic Filled
    • Halogen Free
    • Flammability (UL94 V-0)
    • UL MOT 155ºC
    • Easy handling (like rubber)

    Application

    • Good Adhesion
    • High Working Voltage [≥500Volts]
    • Heavy Copper Filled
    • Power Conversion
    • Monitor Drives
    • Rectifiers, Power Supply
    • Metal in Board (MiB) applications including Coins and Inserts, Pedestal, etc.

    Storage Condition

    RCF
    Storage Condition Temperature Below 23˚C (73˚F) Below 5˚C (41˚F)
    Relative Humidity Below 55% RH /

    Properties

    Properties Test Method Units 100μm 125μm 150μm
    Thermal Conductivity ISO 22007-2 W/mK 7.0
    Thermal Impedance ISO 22007-2 ˚C*in2/W 0.022 0.028 0.035
    Tg DMA IPC-TM-650 2.4.24.4 °C 210
    Td TGA ASTM D3850 °C 420
    Thermal Stress @ 288˚C solder dip IPC-TM-650 2.4.13.1 Minute ≥5
    Hi-Pot Withstand DC IPC-TM-650 2.5.7 Volt >600
    Breakdown Voltage AC IPC-TM-650 2.5.6.3 Volt 8000 9000 10000
    Dk @ 1MHz C-24 / 23 / 50 IPC-TM-650 2.5.5.3 - 4.25
    Dk @ 10GHz 4.57
    Df @ 1MHz C-24 / 23 / 50 IPC-TM-650 2.5.5.3 - 0.0015
    Df @ 10GHz 0.0017
    Volume Resistance After Moisture Resistance IPC-TM-650 2.5.17.1 MΩ-cm 5.0E+8
    E-24/125 IPC-TM-650 2.5.17.1 MΩ-cm 3.0E+7
    Surface Resistance After Moisture Resistance IPC-TM-650 2.5.17.1 MΩ 2.0E+7
    E-24/125 IPC-TM-650 2.5.17.1 MΩ 5.0E+6
    Peel Strength 1oz (As received) IPC-TM-650 2.4.8 lb/in 5.2
    CTI As received ASTM D3638 Volt 600
    Flammability (As received) UL-94 Rating V-0

    All test data provided are typical and not intended to be specification values.

    Availability

    Press Ply Thickness 100μ/125μ/150μ (0.004”/ 0.005”/ 0.006”)
    Panel Size 460*610mm, 510*610mm, 533*610mm 18.11*24.02", 20.08*24.02", 20.98*24.02" or as required
    PET (Standard) T

    RCF Part Numbers

    Description Part Number PPT (μm) Flow Range
    thermal-bond 7.0F RCF Regular Flow PPT 100μm 4B7H-FT R-100 100 20~60
    thermal-bond 7.0F RCF High Flow PPT 100μm 4B7H-FT H-100 100 60~250
    thermal-bond 7.0F RCF Regular Flow PPT 125μm 4B7H-FT R-125 125 40~80
    thermal-bond 7.0F RCF High Flow PPT 125μm 4B7H-FT H-125 125 80~300
    thermal-bond 7.0F RCF Regular Flow PPT 150μm 4B7H-FT R-150 150 60~100
    thermal-bond 7.0F RCF High Flow PPT 150μm 4B7H-FT H-150 150 100~400

    Disclaimer: The information and data contained in this technical literature is based on data and knowledge correct at the time of publishing/printing and is believed to be accurate and is offered in good faith for the benefit of the user. The user should make his own tests to verify the suitability of this product for any application before its use. All data are typical values only and subject to change without notice.

    Download TDS Datasheet