• Thermal-bond 7.0F VT-4BC RCF Thermally Conductive Resin Coated Film Bondply

    UL Approval: E214381 Version: 13/01/2025 Resin Coated Film (RCF) Thermal bond is an unreinforced adhesive system coated onto PET/PI film for use in high performance and high reliability multilayer PCB stack-ups. VT-4BC RCF is a high Tg, ceramic-filled, thermally conductive (9.0 W/mK), halogen-free thermoset resin system, specifically designed for use in multilayer PCBs requiring enhanced levels of heat management and thermal conductivity. Thermal bond RCF can be combined with other Ventec laminate & prepreg systems including tec-thermal IMS, VT-5A2 and VT-4A2H thermally conductive laminates & prepregs in hybrid stack-ups.

    General Information

    • Thermal conductivity -- 9 W/mK
    • Tg 210˚C
    • Ceramic Filled 
    • Halogen Free
    • Flammability (UL94 V-0)
    • UL MOT 155˚C
    • Easy handling (like rubber)

    Application

    • Good Adhesion
    • High Working Voltage [≥500Volts]
    • Heavy Copper Filled
    • Power Conversion
    • Monitor Drives
    • Rectifiers, Power Supply
    • Metal in Board (MiB) applications including Coins and Inserts, Pedestal, etc

    Availability

    Press Ply Thickness 120µ/150µ (0.005”/0.006”) Description Part Number PPT (µm) Flow Range
    Panel Size 460*610mm, 510*610mm, 533*610mm, 18.11*24.02”, 20.08*24.02”, 20.98*24.02”. or as required thermal-bond 7.0F RCF Regular Flow PPT 120µm 4BC-FT R-120 120 40~80
    thermal-bond 7.0F RCF Regular Flow PPT 150µm 4BC-FT R-150 150 60~100

    Carrier Film Type
    PET (Standard) T
    PI (as required) I

    Properties

    Properties Sheet

    Properties Test Method Units 120um 150um
    Thermal Conductivity ISO 22007-2 W/m*K 9.0
    Thermal Impedance ISO 22007-2 ˚C *in2/W 0.021 0.026
    Tg DMA IPC-TM-650 2.4.24.4 °C 210
    Td TGA ASTM D3850 °C 400
    Thermal Stress @ 288˚C solder dip IPC-TM-650 2.4.13.1 Minute ≥5
    Hi-Pot Withstand DC IPC-TM-650 2.5.7 Volt >600
    Breakdown Voltage AC IPC-TM-650 2.5.6.3 Volt 8000 10000
    Electrical Properties
    Dk @ 1MHz C-24 / 23 / 50 IPC-TM-650 2.5.5.3 - 4.25
    Df @ 10GHz 4.57
    Dk @ 1MHz C-24 / 23 / 50 IPC-TM-650 2.5.5.3 - 0.0015
    Df @ 10GHz 0.0017
    Volume Resistivity After Moisture Resistence IPC-TM-650 2.5.17.1 MΩ-cm 5.0E+8
    E-24/125 3.0E+7
    Surface Resistance After Moisture Resistence IPC-TM-650 2.5.17.1 MΩ 2.0E+7
    E-24/125 5.0E+6
    Mechanical Properties
    Peel Strength (1oz) As received IPC-TM-650 2.4.8 lb/in 4.3
    CTI As received ASTM D3638 Volt 600
    Physical Properties
    Flammability As received UL-94 Rating V-0

    Note: All test data provided are typical values and are not intended to be specification value.

    Storage Condition

    RCF
    Storage Condition Temperature < 23˚C (73˚F) < 5˚C (41˚F)
    Relative Humidity < 55% /

    Disclaimer: The information and data contained in this technical literature is based on data and knowledge correct at the time of publishing/printing and is believed to be accurate and is offered in good faith for the benefit of the user. The user should make his own tests to verify the suitability of this product for any application before its use. All data are typical values only and subject to change without notice.

    Download TDS Datasheet